X-Ray Imaging

Real-time x-ray imaging is done in transmission and the image can be captured using film or an x-ray imaging system. The sample may be rotated to allow various perspectives, within the limitations of the sample size and geometry.
X-ray imaging is a quick, non-destructive analysis technique to look at solder joint quality and the large scale structure of devices.

Typical applications

  • Failure analysis
  • Reverse engineering
  • Reliability analysis
  • Forensic analysis

Detection of:

  • Defects and voids in BGA balls, QFNs
  • Wire bonding defects
  • Metallization burnout
  • Voids in through hole pins.

Evaluation of:

  • Die attach integrity
  • Solder bump quality

Techniques

  • 100kV x-ray imaging system upgraded to 1024×1024 pixel CMOS sensor
  • X-ray on film for military applications
  • 3D x-ray available by special request

If defects are detected, recommendations are made for further tests or analyses.