BGA Layer by Layer Construction Analysis

Construction Analysis documents the critical parameters of the materials within a device in order to verify specifications. Cross-sections of devices are performed at specific locations to document layer stack-up, via construction, and material composition. Some devices are delayered to reveal the structure of internal layers. All lines and spaces are measured.

Typical applications

  • Quality documentation
  • Supplier evaluation
  • Non-conformance verification
  • Failure analysis
  • Reliability qualification
  • Technology cloning
  • Destructive Physical Analysis (DPA)
  • Intellectual property violation
  • Counterfeit detection

Techniques

  • X-Ray imaging
  • Acoustic microscopy
  • Electron microscopy with EDX
  • X-Ray Fluorescence (XRF) spectroscopy
  • Raman spectroscopy
  • FTIR spectroscopy
  • Confocal Laser Scanning Microscopy (CLSM)